Home > SMT Stencil Printer

  • China second hand Automatic Solder paste printer
China second hand Automatic Solder paste printer

China second hand Automatic Solder paste printer

  • Power Supply: AC:220±10%,50/60HZ
  • Control Method: PC Control
  • PCB Size/Max: 850*500mm
  • Weight Approx:1300Kg
  • Product description: Power Supply: AC:220±10%,50/60HZ ,Control Method: PC Control,PCB Size/Max: 850*500mm,Weight Approx:1300Kg
  • INQUIRY

China second hand Automatic Solder paste printer

Specifications:


General Introduction

1. Product Functions

F850 is a high accuracy extra dimension printing robot designed for high precision screen printing or stencil printing in SMT industry.

2. Product Features

i. Wide compatibility for PCB dimensions from 100mm x 80mm to 850mm x 500mm and PCB thickness from 0.8mm to 6mm.

ii. High printing resolution

1. High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm.

2. Support glue printing.

iii. Automatic control improves production efficiency, quality control and saves production cost:

1. Automatic stencil positioning

2. Automatic PCB alignment

3. Automatic adjustment of squeegee pressure

4. Automatic printing

5. Automatic stencil cleaning (dry-type, wet-type and vacuum-type)

iv. Adopt company independently developed suspended print head and programmable automatic pressure adjustment system with pressure closed-loop feedback. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.

v. Programmable motor controls squeegees separation speed and distance among squeegees, steel mesh and substrate board to realize multi-method separation.

vi. Multi-functional PCB positioning and clamping system for fast, convenient and accurate PCB positioning.

vii. Upward and downward visual positioning.

viii. Built-in image processing system

ix. Support 2D,SPC functions

3. Applicable pitches of Components

i. SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications.

ii. IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm.

iii. Printing size?100mm x 80mm ~850 mm x 500 mm

iv. PCB Thickness?0.8 mm ~ 6 mm

v. FPC Thickness?thickness? 0.8 mm (excluding jig)

4. Applicable PCB Types

Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products

Specification

* The following data is obtained under ambient temperature of 25  and humidity of 60%